Community

Featured post
Researchers are tackling key 6G challenges—from ultra-fast photonic AI for real-time RF processing to novel GaN amplifier behavior and ultra-compact phased-array packaging.
Featured post
Rohm claims the new microcontroller is the first to employ on-device AI learning without a network connection.
Featured post
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry has announced the launch of the GENESIS project.
Featured post
Panasonic Industry Europe has launched the ZVU Series Hybrid Capacitors, a solution tailored to meet the escalating demands of advanced electronic systems.
Featured post
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
Featured post
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
Featured post
The new processor reportedly offers 100x lower latency and 500x lower energy consumption than conventional AI processors.
Featured post
The new development kit helps designers create industrial systems incorporating actuators and sensors.
Featured post
The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
Featured post
The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.
Top