Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for embedded designs under tight constraints.
Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.
While one of the new DSP PHYs reportedly offers the industry’s lowest power consumption for 800G, the other is the first 200G/lane DSP with integrated VCSEL drivers.