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The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
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The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.
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TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.
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Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for embedded designs under tight constraints.
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Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.
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The new device keeps the high-frequency switching benefits of GaN while addressing the historical lack of a true reverse body diode.
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The release marks Renesas' first AEC-Q100-qualified Bluetooth Low Energy SoC, offering a high level of integration and power efficiency.
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The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities from 32 Kb to 2 Mb.
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Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK
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In this roundup, we cover four newly announced parts from Nuvoton, Nexperia, TDK, and Microchip, targeting various systems in the modern vehicle.
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