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As the AI industry hits an energy wall, Arago is rewriting the rules of compute.
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The new power-management IC integrates advanced system management and ultra-low power fuel gauging in a single chip.
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Built on proven SuperGaN Technology, 650-V Gen IV Plus devices are designed to deliver robust performance with superior thermal efficiency and ultra-low power loss
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As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.
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MEMS microphones, ToF sensors, and motion-tracking IMUs from TDK deliver responsive, energy-efficient performance across smart home appliances, remotes, speakers, locks, and more.
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Researchers are tackling key 6G challenges—from ultra-fast photonic AI for real-time RF processing to novel GaN amplifier behavior and ultra-compact phased-array packaging.
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Rohm claims the new microcontroller is the first to employ on-device AI learning without a network connection.
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A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry has announced the launch of the GENESIS project.
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Panasonic Industry Europe has launched the ZVU Series Hybrid Capacitors, a solution tailored to meet the escalating demands of advanced electronic systems.
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Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
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