The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.
Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for embedded designs under tight constraints.
Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.