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Espressif Bundles Wi-Fi 6, Bluetooth 5.4, and HMI Into RISC-V SoC

The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.

Foxconn Wins Approval to Build New Manufacturing Plant in Vietnam

Foxconn, Apple’s top manufacturing partner, just won local government approval to build a $270 million factory in Vietnam.

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Development Boards Built to Kick Start Automotive, Edge AI, & IoT Design

Renesas, Infineon, Edge Impulse, and AnalogLamb have released boards and kits—all with the goal of accelerating development cycles in embedded systems.

Raspberry Pi 5 Shows Off New In-House Silicon for Fastest Speeds Yet

Integrating custom-made silicon, the newest Raspberry Pi offers improved performance in a familiar form factor.

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.

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