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EPC recently announced a new reference design for BLDC motor drives to provide intricate motor control in humanoid robots.
TE Connectivity AmbiMate Sensor Module MS4 Series offers an application specific set of sensors on a ready to attach PCB assembly for easy integration.
Two relatively new players in the CPU world, Semidynamics and Signature IP, have announced multi-core RISC-V and CHI interconnect IP for compute-intensive applications like AI/ML.
Renesas has temporarily suspended production at one of its Japanese plants following a 7.3 magnitude earthquake in its vicinity.
TDK-Lambda 300W-504W quarter brick converters are offered at Sourengine. Download data sheets, shop and learn more.
Spot prices for DRAM modules have reached their highest level in two years because of the global semiconductor shortage.