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Spot prices for DRAM modules have reached their highest level in two years because of the global semiconductor shortage.
The CryoCMOS Consortium has demonstrated transistor models operable at 4K and 77K, opening more doors for conventional electronics to operate at cryogenic temperatures.
The latest members of the low-power, low-density FPGA product line feature instant-on with 896 to 9400 look-up tables.
Some of the biggest impacts in power electronics stem from MOSFET innovation. Here are a few importable offerings from Rohm, Littelfuse, and Magnachip.
Apple and Intel plan to use TSMC’s 3nm manufacturing process to make their next-generation consumer and business products.
TSMC will construct an $8.8 billion chip factory in Japan. However, its capacity expansion will likely increase components costs industrywide.