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The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.
Foxconn, Apple’s top manufacturing partner, just won local government approval to build a $270 million factory in Vietnam.
Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK
Renesas, Infineon, Edge Impulse, and AnalogLamb have released boards and kits—all with the goal of accelerating development cycles in embedded systems.
Integrating custom-made silicon, the newest Raspberry Pi offers improved performance in a familiar form factor.
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.