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A space-grade quad LVDS line driver targets modern spacecraft data links with 600-Mbps throughput and wide-range CMOS compatibility.
TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.
TSMC will construct an $8.8 billion chip factory in Japan. However, its capacity expansion will likely increase components costs industrywide.
The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA in deep sleep.
As we enter 2025, the semiconductor industry is at a crossroads of ongoing innovation and lurking uncertainty.
Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.