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AMD Patent Filing Reveals Future CPU-FPGA Hybrid

Based on its recent patent filing, AMD has developed a new chip that harnesses the power of a CPU and the flexibility of an FPGA.

Daimler expects global chip shortage to continue until 2022

Daimler executives predict the global chip shortage will continue affecting the corporation's manufacturing and sales through 2022.

Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.

TI’s PLDs Help Engineers Leap From Concept to Prototype in a Snap

The new family of programmable logic devices highly integrates features to reduce board space by up to 94%.

Microchip Technology’s PIC24F GU/GL MCUs

Learn more about Microchip Technology's PIC24F GU/GL microcontrollers and the amazing, versatile applications they have in today's cutting-edge technology products.

Oppo designing 3nm smartphone chipsets in-house, TSMC handling production

Oppo, a leading Chinese smartphone maker, reportedly plans to release self-designed 3nm SoCs for its future handsets.

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