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ST Launches LVDS Driver for High-Speed Data and Low-Voltage Logic

A space-grade quad LVDS line driver targets modern spacecraft data links with 600-Mbps throughput and wide-range CMOS compatibility.

TI Unveils GaN Device for Motor Energy Efficiency

TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.

TSMC to build $8.8B chip plant in Japan with government support

TSMC will construct an $8.8 billion chip factory in Japan. However, its capacity expansion will likely increase components costs industrywide.

ST Rolls Out Battery Management IC for Lithium Packs Up to 10 Cells

The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA in deep sleep.

Forecasts for 2025 Semiconductor Growth Teeter on Several Factors

As we enter 2025, the semiconductor industry is at a crossroads of ongoing innovation and lurking uncertainty.

Nexperia Introduces Tiny Leadless Logic ICs for Automotive Designs

Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.

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