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The average lead time for microchips has risen to 22 weeks, a new record and up nine weeks from the same time last year.
Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.
Sourcengine has high-quality microprocessors available for immediate delivery.
As the AI industry hits an energy wall, Arago is rewriting the rules of compute.
ST’s new solution has a highly integrated analog front end for advanced wearable features.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.