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Arm Reveals Plans to Outfit Its GPUs With Dedicated Neural Accelerators

New AI upscaling tech points to a 2026 mobile graphics future driven by on-chip inference.

High-Speed Connectors Support Harsh Environment Applications

Harsh environments require a specialized connector to maintain high-speed data transfer. Sourcengine's catalog offers the greatest variety of these high-speed connectors.

The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins

The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins

Chipmakers ramp up development of SiC, GaN parts amid global EV push

Chipmakers are developing SiC and GaN parts production technologies to take advantage of the electric vehicle sector’s explosive growth.

Power Integrations Extends Flyback Topology to 440W With GaN

At APEC 2026, Power Integrations introduced its TopSwitchGaN 440 W, which unites PowiGaN switches with traditional TOPSwitch architecture, simplifying high-power designs.

Memory Leaders Rise to Meet the Storage Challenges of AI

At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the age of AI—from SSD controllers to LPDDR5X DRAM.

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