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Chip lead times reach 22 weeks following Chinese power cutbacks

The average lead time for microchips has risen to 22 weeks, a new record and up nine weeks from the same time last year.

Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.

Sourcengine can ship robust, high-performance microprocessors worldwide

Sourcengine has high-quality microprocessors available for immediate delivery.

Arago’s Light-Speed Gamble: Can Photonics Reinvent the AI Chip?

As the AI industry hits an energy wall, Arago is rewriting the rules of compute.

STMicroelectronics Rolls Out Biosensor for Health and Fitness Wearables

ST’s new solution has a highly integrated analog front end for advanced wearable features.

EDA Companies Throw Support Behind TSMC’s New A14 Process

TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.

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