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AMD Patent Filing Reveals Future CPU-FPGA Hybrid

Based on its recent patent filing, AMD has developed a new chip that harnesses the power of a CPU and the flexibility of an FPGA.

TE Connectivity AmbiMate MS4 Sensor Series

TE Connectivity AmbiMate Sensor Module MS4 Series offers an application specific set of sensors on a ready to attach PCB assembly for easy integration.

Synopsys Debuts Full-stack AI-based EDA Tool Suite for IC Engineers

At today’s Synopsys Users Group (SNUG) event, Synopsys has unveiled a full-stack suite of AI-based EDA tools.

AMD to Bring UCIe Chiplet Connectivity to Versal RF Adaptive SoCs

Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to co-package third-party chiplets.

Synopsys Acquires Ansys for $35B, Creating Silicon-to-Systems Powerhouse

The merger combines Synopsys’ EDA dominance with Ansys’ multiphysics simulation expertise, promising a new era of co-optimized chip and system design.

BrainChip Accelerates AI at the Edge With New Low-Power Neural Processor

The Akida Pico low-power acceleration co-processor may drive compact AI-enabled wearables and sensors for consumer, healthcare, and IoT applications.

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