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TSMC and Japanese government launching $337M 3D chip development project

TSMC and the Japanese government are co-funding a potentially revolutionary $337 million semiconductor research project.

Nexperia Introduces Tiny Leadless Logic ICs for Automotive Designs

Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.

Malaysia’s rising COVID-19 cases disrupt global electronic components supply chain

Malaysia enacted a nationwide lockdown in response to rising COVID-19 cases. In response, some automakers have cut their production quotas.

Micron to spend $150B on global R&D, production capacity expansion

Micron Technology revealed it would spend $150 billion over the next ten years to enhance its R&D and manufacturing resources worldwide.

New ZVU series for Panasonic’s range of hybrid caps

Panasonic Industry Europe has launched the ZVU Series Hybrid Capacitors, a solution tailored to meet the escalating demands of advanced electronic systems.

Infineon Levels Up Machine Learning Performance With Three New MCUs

Infineon has added three PSOC Edge MCUs with Arm Cores and dual-domain architectures to ramp up edge performance.

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