The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
Nexperia has released 16 new planar Schottky diodes in CFP2-HP packaging. The CFP2-HP packaging comes in a compact 2.65 mm x 1.3 mm x 0.68 mm size, including the leads. These diodes follow the IC industry’s trend towards smaller footprints for automotive and industrial devices.
Nexperia claims the new package options shrink device footprint while maintaining high heat dissipation.
CFP: A Replacement for SMA/SMB/SMC Packages?
In the past three decades, SMA/SMB/SMC (SMX) packaging has been the industry standard for power rectifier diodes. However, with increasingly complex circuit designs, the space budget allocated for each PCB component has become tighter. Nexperia has developed Clip-bonded FlatPower (CFP)-packaged Schottky rectifiers as a solution to some of the size-related issues of outdated SMX packages.
Size comparison of CFP variants.
Nexperia’s portfolio features four package options for space-saving designs, all with flatter profiles. They come at heights <= 1 mm—much flatter than the ~2 mm tall SMA packages. Most options also feature smaller surface areas. These size savings allow designers to fit power electronics in increasingly tight spaces.
The CFP package uses solid copper clips as the contact area. Nexperia says that these provide lower thermal resistance and low inductance. The clip leads were designed to ensure uniform solder joints and allow AOI. The CFP packages are AEC-Q101 qualified, Board Level Reliability compliant, and qualified for junction temperatures up to 175°C.
Nexperia Packs More Power into Smaller Schottky Diodes
Nexperia introduced 16 new low reverse-voltage planar Schottky diodes under the CFP portfolio. These CFP2-HP Schottky diodes are separated into eight industrial and eight AEC-Q101 qualified options. The portfolio offers four choices of max reverse voltages (VR(max)) at 20 V, 30 V, 40 V, and 60 V. Forward currents (IF(average)) come in options of 1 A and 2 A. These ICs additionally provide an automotive option with AEC-Q101 qualification, enabling easy integration in automotive circuits. The company expects applications in low-voltage rectification, DC-to-DC conversion, freewheeling, reverse polarity protection, and OR-ing.
The parts are named according to voltage and current options. For example, the PMEG4010EXD Schottky barrier rectifier (datasheet linked) has a reverse voltage of 40 V and a forward current of 1 A. The PMEG3020EXD-Q Schottky barrier rectifier (datasheet linked) has a reverse voltage of 30 V, a forward current of 2 A, and the AEC-Q101 qualification marked with the “-Q”.
Small Outline Diode (SOD) Packaging
These ICs come in a CFP2-HP packaging under the name SOD323HP, with the SOD standing for "small outline diode." The SOD323HP has a 2.2 mm x 1.3 mm x 0.68 mm plastic surface-mounted body. It features clip-based leads designed for side-wettable flanks. It fits in a footprint dimension of 3.3 mm x 1.6 mm. The CFP2-HP has exposed heatsinks and enables heat dissipation (P_tot). Nexperia claims that it is comparable to that of typical SMA packages, despite its much smaller size.
The SOD323HP is a plastic surface-mounted package with side-wettable flanks (1.3 mm x 2.2 mm x 0.68 mm).
Nexperia’s CFP2-HP Schottky diodes are available now for purchase alongside other power diode devices in the CFP family.
