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TI Unveils GaN Device for Motor Energy Efficiency

TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.

Asset Tracker Test Proves Efficacy of ZETA, a New LPWA Network

Socionext and Techsor recently tested the indoor and outdoor performance of IoT tags using the low-power wide area network ZETA—and the results showed bright promise for asset tracking.

2022 Industry Insights: Predictions for the Global Semiconductor Sector

Sourcengine’s 2022 industry insight report discusses the availability, pricing, and risk issues that will affect the marketplace next year.

Passive, Reactive Component Lead Times Increase Amid Global Chip Shortage

Tight production capacity and raw material shortages have exacerbated the effects of the global chip shortage.

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Qualcomm reportedly inks six-year foundry services agreement with UMC

Qualcomm made a six-year deal supply deal with UMC, the world’s fourth-largest contract chipmaker. Read more here.

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