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How Times Square’s New Year’s Eve Ball Got Its Sparkle

The Times Square Ball has come far from its first iron-and-wood model. Here's how the New Year's Eve icon has evolved over the past century.

Microchip Technology unveils 32-bit MCU family with integrated high-performance analog peripherals

To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs.

BrainChip Accelerates AI at the Edge With New Low-Power Neural Processor

The Akida Pico low-power acceleration co-processor may drive compact AI-enabled wearables and sensors for consumer, healthcare, and IoT applications.

China Forms Semiconductor Development Standards Committee

The Chinese government established a committee that includes Huawei, SMIC, and Alibaba, to develop new semiconductor development standards.

Texas Instrument's New DC/DC Buck-Boost Converters Can Make IIoT Projects Better

Texas instruments’ DC-DC buck-boost converter can extend IIoT equipment battery life by 50 percent.

Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Boasting a cost-effective approach, today Kinara is rolling out its new edge AI processor designed to take on the demanding workloads brought on by generative AI.

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