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AMD Patent Filing Reveals Future CPU-FPGA Hybrid

Based on its recent patent filing, AMD has developed a new chip that harnesses the power of a CPU and the flexibility of an FPGA.

Intel Increases Investment in Vietnam by $475M for Cutting-Edge Semiconductor Plant

Intel invested $475 million into its IPV chip testing and assembly center in Vietnam. The move supports its long-term business strategy.

How Digitalization Makes Electronic Components Procurement More Efficient

Streamlining the procurement process is top of mind for anyone working in the electronic components industry. Learn how digitalization is the next step.

Nexperia Introduces Tiny Leadless Logic ICs for Automotive Designs

Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.

GlobalFoundries begins construction on $4B 300mm wafer fab in Singapore

GlobalFoundries recently broke ground on a $4 billion, 300mm Singapore-based silicon wafer fab that will begin full production in 2023.

Samsung to begin fabricating products with 3nm GAA node in 2022

Samsung intends to begin manufacturing chips utilizing its newly developed 3nm GAA process beginning in 2022.

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