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Microchip Technology unveils 32-bit MCU family with integrated high-performance analog peripherals

To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs.

New Memory, Power, and MIMO Devices Target ‘NewSpace’ in Low Earth Orbit

As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.

New Power Components Tackle Tough Design Challenges

TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.

Passive, Reactive Component Lead Times Increase Amid Global Chip Shortage

Tight production capacity and raw material shortages have exacerbated the effects of the global chip shortage.

As Lead Times Grow for Power MOSFETS the Industry Adapts: Current Market Trends for MOSFETs

MOSFET is an abbreviation for “Metal Oxide Semiconductor Field Effect Transistor” and can be well-defined as a power semiconductor that is used as an electronic switch device to control the loads as p

Oppo designing 3nm smartphone chipsets in-house, TSMC handling production

Oppo, a leading Chinese smartphone maker, reportedly plans to release self-designed 3nm SoCs for its future handsets.

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