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Based on its recent patent filing, AMD has developed a new chip that harnesses the power of a CPU and the flexibility of an FPGA.
Intel invested $475 million into its IPV chip testing and assembly center in Vietnam. The move supports its long-term business strategy.
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Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.
GlobalFoundries recently broke ground on a $4 billion, 300mm Singapore-based silicon wafer fab that will begin full production in 2023.
Samsung intends to begin manufacturing chips utilizing its newly developed 3nm GAA process beginning in 2022.