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New AI upscaling tech points to a 2026 mobile graphics future driven by on-chip inference.
Samsung announces plans to triple its current production capacity by 2026 amid high demand for its services.
At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the age of AI—from SSD controllers to LPDDR5X DRAM.
The Evergreen Vento FCM33 delivers modular 33 kW shelves with over 95% efficiency for semiconductor and industrial DC power systems.
Announced today, the new device challenges the assumption that Ethernet can't support small packet sizes or optimized transport paths
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