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The new RZ/T2H chip combines multiple cores, real-time control, Ethernet, and advanced security into a one-chip microprocessor.
Samsung plans to spend $17 billion on a new fabrication facility in Austin, Texas. The facility may feature EUV lithography machines for advanced components.
NXP Semiconductors just introduced new vehicle radar sensor products to help manufacturers create digital safety cocoons for new cars.
Nvidia’s Jetson Nano SOM unlocks the potential of the nascent connected robotics and embedded analytics device markets.
GlobalFoundries recently broke ground on a $4 billion, 300mm Singapore-based silicon wafer fab that will begin full production in 2023.
In this roundup, we highlight three embedded boards that come in versatile form factors for various applications.