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Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Murata, Melexis, and TI Push Boundaries on Low-Power Sensing Design

New sensing solutions, from pyroelectric infrared sensors to in-plane Hall-effect switches, help engineers improve performance and efficiency in space-constrained designs.

Texas Instruments has the parts OEMs need to make the 2021 holiday season profitable

Texas Instruments has components available to help manufacturers address holiday season demand despite the global chip shortage.

EDA Companies Throw Support Behind TSMC’s New A14 Process

TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.

Qualcomm Raises the Bar on Thin, Light PC Performance With New CPU

The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.

Sourcing in the Digital Age: An Interview with Sourceability's CEO Jens Gamperl

Sourceability's CEO Jens Gamperl provides insights into how the landscape of buying and selling electronic components is changing in the digital age. For that reason he created Sourcengine, an e-

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