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Broadcom Aims to Reimagine the Ethernet Switch for HPC and AI

Announced today, the new device challenges the assumption that Ethernet can't support small packet sizes or optimized transport paths

Samsung to begin fabricating products with 3nm GAA node in 2022

Samsung intends to begin manufacturing chips utilizing its newly developed 3nm GAA process beginning in 2022.

Qualcomm reportedly inks six-year foundry services agreement with UMC

Qualcomm made a six-year deal supply deal with UMC, the world’s fourth-largest contract chipmaker. Read more here.

Yageo to Acquire Competitor Kemet in $1.8 Billion Deal

Yageo Corporation will acquire KEMET in a definitive deal set to close in the second half of 2020. Yageo and KEMET will have a mutual market share of about $3 billion.

South Korea Invests $176B into its Domestic Automotive Chip Industry

South Korea's government announced it will spend $176.8 billion to support and modernize its domestic automotive semiconductor industry.

EPC Gets Granular: Motor Drive Reference Design Targets Robotic Joints

EPC recently announced a new reference design for BLDC motor drives to provide intricate motor control in humanoid robots.

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