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TSMC is increasing its car MCU production to address the global chip shortage. But insiders believe the component crunch will last until 2022.
The new device keeps the high-frequency switching benefits of GaN while addressing the historical lack of a true reverse body diode.
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Deembedding Test Fixtures for High-Speed Digital Applications
Arm's third generation of its Neoverse IP is designed to maximize TCO for intensive workloads and support new technologies like chiplets.
Socionext and Techsor recently tested the indoor and outdoor performance of IoT tags using the low-power wide area network ZETA—and the results showed bright promise for asset tracking.