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Built for automotive motor control, the new chips pack power electronics, microcontrollers, and communications circuitry in one chip.
China’s energy crisis has had a negative impact on firms that maintain component factories and chip packaging facilities in the region.
As 2020 draws to a close, we take a look at driving factors in the electronic components industry for 2021. First up: gaming consoles.
Apple and Intel plan to use TSMC’s 3nm manufacturing process to make their next-generation consumer and business products.
The South Korean government revealed its local chipmakers, led by Samsung, will spend $451 billion to upgrade their capabilities through 2030.
Arm's third generation of its Neoverse IP is designed to maximize TCO for intensive workloads and support new technologies like chiplets.